Planar pixel detector module development for the HL-LHC ATLAS pixel system
نویسندگان
چکیده
منابع مشابه
The ATLAS pixel detector
After a ten years planning and construction phase, the ATLAS pixel detector is nearing its completion and is scheduled to be integrated into the ATLAS detector to take data with the first LHC collisions in 2007. An overview of the construction is presented with particular emphasis on some of the major and most recent problems encountered and solved.
متن کاملA MCM-D-type Module for the ATLAS Pixel Detector
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm x 60.4 mm, 16 read out IC's, each serving 24 x 160 pixel unit cells, a module controller chi...
متن کاملDevelopment of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HLLHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and D...
متن کاملCommissioning of the ATLAS Pixel Detector
The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at LHC. Approximately 80 million silicon sensors allow to detect particle tracks and secondary vertices with very high precision. The ATLAS Pixel Detector is now in its final commissioning phase. A full characterization and qualification of the detector is currently performed: calibration procedures, special DAQ runs for...
متن کاملOptical Link of the Atlas Pixel Detector
The on-detector optical link of the ATLAS pixel detector contains radiation-hard receiver chips to decode bi-phase marked signals received on PIN arrays and data transmitter chips to drive VCSEL arrays. The components are mounted on hybrid boards (optoboards). We present results from the irradiation studies with 24 GeV protons up to 32 Mrad (1.2 x 10 p/cm) and the experience from the production.
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
سال: 2013
ISSN: 0168-9002
DOI: 10.1016/j.nima.2013.04.043